Teel Technologies’ new innovative and safe no-heat process for removal, cleaning and troubleshooting BGA chips from the newest mobile phones. This new polishing process provides a safe and clean method of removing and reading BGA chips that are susceptible to heat, vibration and damage as a result of other processes like milling.
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ULTRAPOL lapping and polishing machine offers the build-quality required for high precision manual polishing. The system includes a water system that allows the machine to be self-sustainable without plumbing to the wall.