ULTRAPOL Bundle

Teel Technologies’ new innovative and safe no-heat process for removal, cleaning and troubleshooting BGA chips from the newest mobile phones. This new polishing process provides a safe and clean method of removing and reading BGA chips that are susceptible to heat, vibration and damage as a result of other processes like milling.

Download the Ultrapol Bundle Brochure

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Manual Lapping & Polishing Machine

ULTRAPOL lapping and polishing machine offers the build-quality required for high precision manual polishing. The system includes a water system that allows the machine to be self-sustainable without plumbing to the wall.

Product Highlights

  • Cost-effective manual polisher
  • Can be used with manual tools
  • High Quality Build – long lasting
  • Configured for 120 volt operation, 0-600 RPM.

Part No:
AP-UT-ULTRAPOL-ACK

Teel Technologies represents and resells the full ULTRA TEC line of products. If there is a model you don’t see on our site that you would like more information on, please let us know. We will be happy to provide details and pricing.

2 Stage Reballing-Retinning of BGA Chips

Non-Heat Polishing & PCB Removal


Includes
  • ULTRAPOL Basic Polisher
  • Electro-plated 8″ Diamond Grinding Plate with PSA, 320 mesh – EQ-DGP-8PB320
  • Electro-plated 8″ Diamond Grinding Plate with PSA, 1500mesh – EQ-DGP-8PB1500
  • Electro-plated 8″ Diamond Grinding Plate with PSA, 2000mesh – EQ-DGP-8PB2000
  • (1) 8″ Dia.x 0.8 mm Thick. Permanent Magnetic Sheet with PSA Backing
  • (2) 8″ Dia x 0.7mm Thick Steel Buffer Sheet
  • Roll of double sided tape
  • ULTRAPOL Water System
    • 320 gph statuary fountain pump
    • (1) 4 ft foot length of clear 3/4 ID X 1 OD
    • (1) 4 Ft length of clear 3/8 ID X 1/2 OD
    • (4) Adjustable clamps for each hose
    • (1) Plastic bucket for water and pump
  • Ultratec Manual Parallel Polish Fixture – Includes 3 parallel polishing sample mounts

 

Part No:
AP-UT-ULTRAPOL-ACK