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Dediprog NuProg-E UFS / eMMC Programmer

dediprog-ufs-programmer
NuProg-E is a professional engineering tool that is innovated for programming mass flash storage with its speed and reliability, which is achieved by utilizing industry interface standard of interconnect layer specification, M-PHY and Unipro from MIPI® Alliance. Together with built-in SuperSpeed® USB 3.0 for high speed communication, it is an efficient tool for you to focus on application analysis and product development.

NuProg-E programmer supports Universal Flash Storage (UFS), eMMC and eMCP which are widely used in mobile devices such as smart phones and tablet computers. Designed with complete functional software and user friendly interface, it allows the engineer to define UFS‘s Descriptors, Attributes, Flags, LUN and boot partition; In addition it also provide access to eMMC/eMCP’s User Area, Boot, RPMB, GPP and Enhanced area.

Features

High speed programming
Built in high speed processor to achieve high programming speed(Write speed 50MB/s; Read speed 100MB/s) Timing reference :1GB image file is programmed into Toshiba UFS IC in just 25 seconds

dediprog-nuprog-ufs-gui
UFS Support
1. Supports Descriptors, Attributes, Flags Setting
2. Supports LUN configured and advanced setting
eMMC Support
1. Supports User Area, Boot1/2 Partition and Extend CSD
2. Supports RPMB, GPP1~4 and Enhanced mode
IC package
Support standard packages for UFS and EMMC
or special packages for EMCP
Regular software update
Supports USB2.0 and USB3.0 (using power adapter)
Supports Windows7/8/8.1/10

Part No:
AP-DEDIP-NuProgE


Reballing Tin Plate
Reballing tin plate
Reballing Stencil
Reballing Stencil

 

Aluminum Foil Tape
Aluminum Foil Tape
Solder Paste
Reballing Stencil
Low-Temp Lead-free SMT
Solder Paste
Reballer Kit

This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

  • 1x OSCAFT TSCAFT Aluminum Foil Tape Acrylic Tin Foil Anti Humidity Rust Eectric Conductivity 10mm 0.06 – 0.1mm thick 50MTS
  • SD-528 low temperature SMT Lead-free SMT Solder Paste 500g Sn42Bi58
  • BGA reballing stencil for, BGA221, BGA529, BGA095, BGA153, and BGA169 layouts.

Part No:


 

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Adapters for the Dediprog NuProg-E

UFS BGA095

dediprog-adapter-bga095dediprog-adapter-bga095-profile

UFS BGA95 Chip adapter for the following newer UFS chips:

16 GB KLUAG2G1BD-E0B2
32 GB KLUBG4G1BD-E0B1
64 GB KLUCG8G1BD-E0B1

Usually found on the Samsung S6’s and Note 5’s.

Part No:
AP-DEDIP-BGA095

Adapter Manual
1. Make sure the triangle mark on the bottom left PCB board is aim at the triangle mark on DediProg devices. For more detailed insertion direction, please download the document HERE.
Caution: Incorrect insert the socket adaptor may cause the device and socket damage.
2. Pin 1 of socket is point out the IC pin 1 position. Press down the top of socket to put the IC. Visually check the connection between socket and device is correct then the device is ready to programming.
3. We recommended using a pick up tool for handing with socket. Do not touch the PCB board directly, because dirt and statics may cause errors during programming of device.
4. Please remove the adaptor from the device after you finish work.

dediprog-adapter-bga095-specs

UFS FBGA153

dediprog-adapter-fbga153dediprog-adapter-fbga153-profile

UFS BGA153 adapter for the following newer UFS chips:

Samsung
32 GB KLUBG4G1BD-B0B1
16 GB KLUAG2G1CE-B0B1
32 GB KLUBG4G1CE-B0B1
64 GB KLUCG4J1CB-B0B1
128 GB KLUDG8J1CB-B0B1

Toshiba
32 GB THGBF7G8K4LBATR
64 GBTHGBF7G9L4LBATR
128 GB THGBF7T0L8LBATA
32 GB THGLF2G8D4KBADR
32 GB THGLF2G8J4LBATR

Part No:
AP-DEDIP-FBGA153
Part Code: AP-DEDIP-FBGA153

Adapter Manual
1. Make sure the triangle mark on the bottom left PCB board is aim at the triangle mark on DediProg devices. For more detailed insertion direction, please download the document HERE.
Caution: Incorrect insert the socket adaptor may cause the device and socket damage.
2. Pin 1 of socket is point out the IC pin 1 position. Press down the top of socket to put the IC. Visually check the connection between socket and device is correct then the device is ready to programming.
3. We recommended using a pick up tool for handing with socket. Do not touch the PCB board directly, because dirt and statics may cause errors during programming of device.
4. Please remove the adaptor from the device after you finish work.

dediprog-adapter-fbga153-specs

Additional Socket Adapters

dedprog-nuprog-e-socket-adapters